GB/T 6624-2009
ActiveStandard method for measuring the surface quality of polished silicon slices by visual inspection
硅抛光片表面质量目测检验方法
Application Summary AI generated
This standard specifies the visual inspection method for assessing surface quality defects such as scratches, pits, stains, and particles on polished silicon wafers. It is primarily applied in the semiconductor manufacturing industry for quality control of silicon substrates used in integrated circuit and discrete device fabrication. The standard ensures consistent evaluation criteria between suppliers and users during incoming inspection or process monitoring.
Related Standards
GB/T 12964-2003
Monocrystalline silicon polished wafers
GB/T 16596-1996
Specification for establishing a wafer coordinatesystem
GB/T 16595-1996
Specification for a universal wafer grid
GB/T 12965-2005
Monocrystalline silicon as cut slices and lapped slices
GB/T 20230-2006
Indium phosphide single crystal
GB/T 20229-2006
Gallium phosphide single crystal
GB/T 20228-2006
Gallium arsenide single crystal
GB/T 11071-2006
Zone-refined germanium ingot
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.