GB/T 12964-2003
AbolishedMonocrystalline silicon polished wafers
硅单晶抛光片
Application Summary AI generated
GB/T 12964-2003 specifies the technical requirements, test methods, inspection rules, and packaging for monocrystalline silicon polished wafers used in semiconductor device fabrication. It applies to the production and quality control of polished silicon wafers with diameters up to 200 mm, serving as a key reference for manufacturers and users in the electronics industry. This standard ensures consistent wafer flatness, surface quality, and electrical properties critical for integrated circuit and discrete device manufacturing.
Related Standards
GB/T 16596-1996
Specification for establishing a wafer coordinatesystem
GB/T 16595-1996
Specification for a universal wafer grid
GB/T 12965-2005
Monocrystalline silicon as cut slices and lapped slices
GB/T 20230-2006
Indium phosphide single crystal
GB/T 20229-2006
Gallium phosphide single crystal
GB/T 20228-2006
Gallium arsenide single crystal
GB/T 11071-2006
Zone-refined germanium ingot
GB/T 11070-2006
Reduced germanium ingot
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.