GB/T 12965-2005
AbolishedMonocrystalline silicon as cut slices and lapped slices
硅单晶切割片和研磨片
Application Summary AI generated
GB/T 12965-2005 specifies the technical requirements, dimensions, and testing methods for monocrystalline silicon slices in both as-cut and lapped conditions. It is applied in the semiconductor industry for the production of silicon wafers used in integrated circuits and discrete devices, ensuring quality control during wafer slicing and surface preparation stages.
Related Standards
GB/T 12964-2003
Monocrystalline silicon polished wafers
GB/T 16596-1996
Specification for establishing a wafer coordinatesystem
GB/T 16595-1996
Specification for a universal wafer grid
GB/T 20230-2006
Indium phosphide single crystal
GB/T 20229-2006
Gallium phosphide single crystal
GB/T 20228-2006
Gallium arsenide single crystal
GB/T 11071-2006
Zone-refined germanium ingot
GB/T 11070-2006
Reduced germanium ingot
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.