GB/T 16595-1996

Abolished

Specification for a universal wafer grid

晶片通用网格规范

Standard Type

GBT

ICS

29.045

CCS

H82

Status

Abolished

Issue Date

1996-11-04

Implementation

1997-04-01

Centralized Committee

国家标准委

Issuing Authority

国家技术监督局

Application Summary AI generated

This standard specifies the dimensions, tolerances, and layout of a universal grid pattern used for mapping and positioning semiconductor wafers during fabrication and testing. It is applied in the microelectronics industry to ensure consistent alignment and measurement across photolithography, inspection, and dicing processes for silicon wafers. The grid facilitates compatibility between different manufacturing equipment and quality control systems.

Related Standards

GB/T 12964-2003 Monocrystalline silicon polished wafers GB/T 16596-1996 Specification for establishing a wafer coordinatesystem GB/T 12965-2005 Monocrystalline silicon as cut slices and lapped slices GB/T 20230-2006 Indium phosphide single crystal GB/T 20229-2006 Gallium phosphide single crystal GB/T 20228-2006 Gallium arsenide single crystal GB/T 11071-2006 Zone-refined germanium ingot GB/T 11070-2006 Reduced germanium ingot

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.