GB/T 16596-1996
AbolishedSpecification for establishing a wafer coordinatesystem
确定晶片坐标系规范
Application Summary AI generated
This standard specifies the coordinate system for defining locations on semiconductor wafers, including the origin, axes orientation, and notation for wafer flats or notches. It is applied in the semiconductor industry for wafer mapping, defect tracking, and process alignment during fabrication, testing, and inspection. The standard ensures consistent communication of wafer positions across manufacturing equipment and quality control systems.
Related Standards
GB/T 12964-2003
Monocrystalline silicon polished wafers
GB/T 16595-1996
Specification for a universal wafer grid
GB/T 12965-2005
Monocrystalline silicon as cut slices and lapped slices
GB/T 20230-2006
Indium phosphide single crystal
GB/T 20229-2006
Gallium phosphide single crystal
GB/T 20228-2006
Gallium arsenide single crystal
GB/T 11071-2006
Zone-refined germanium ingot
GB/T 11070-2006
Reduced germanium ingot
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.