GB/T 6619-2009
ActiveTest methods for bow of silicon wafers
硅片弯曲度测试方法
Application Summary AI generated
This standard specifies the test methods for measuring the bow (curvature) of silicon wafers used in semiconductor manufacturing. It is applied in the quality control and inspection of polished or epitaxial silicon wafers to ensure they meet flatness requirements for photolithography and device fabrication. The standard is critical for wafer suppliers and semiconductor fabs to prevent yield loss due to wafer warpage during processing.
Related Standards
GB/T 12964-2003
Monocrystalline silicon polished wafers
GB/T 16596-1996
Specification for establishing a wafer coordinatesystem
GB/T 16595-1996
Specification for a universal wafer grid
GB/T 12965-2005
Monocrystalline silicon as cut slices and lapped slices
GB/T 20230-2006
Indium phosphide single crystal
GB/T 20229-2006
Gallium phosphide single crystal
GB/T 20228-2006
Gallium arsenide single crystal
GB/T 11071-2006
Zone-refined germanium ingot
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.