GB/T 6617-2009
ActiveTest method for measuring resistivity of silicon wafer using spreading resistance probe
硅片电阻率测定 扩展电阻探针法
Application Summary AI generated
This standard specifies a test method for measuring the resistivity of silicon wafers using a spreading resistance probe. It is applied in the semiconductor industry for quality control and material characterization of silicon wafers, particularly for evaluating resistivity variations across the wafer surface. The method is used in manufacturing and research settings to ensure consistent electrical properties for integrated circuit fabrication.
Related Standards
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GB/T 16596-1996
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GB/T 16595-1996
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Monocrystalline silicon as cut slices and lapped slices
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Zone-refined germanium ingot
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.