GB/T 31476-2015
ActiveRequirements for solders for high-quality interconnections in electronics assembly
电子装联高质量内部互连用焊料
Application Summary AI generated
This standard specifies the composition, purity, and performance requirements for solders used in high-reliability electronic assemblies, such as those in aerospace, military, and medical devices. It ensures that solder materials achieve consistent mechanical strength and electrical conductivity for critical internal interconnections. The standard is applied during the procurement and quality control of solder alloys for automated or manual assembly processes in the electronics manufacturing industry.
Related Standards
GB/T 12964-2003
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Monocrystalline silicon as cut slices and lapped slices
GB/T 20230-2006
Indium phosphide single crystal
GB/T 20229-2006
Gallium phosphide single crystal
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Gallium arsenide single crystal
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Zone-refined germanium ingot
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.