GB/T 30656-2014
AbolishedPolished monocrystalline silicon carbide wafers
碳化硅单晶抛光片
Application Summary AI generated
GB/T 30656-2014 specifies the technical requirements, test methods, inspection rules, and packaging for polished monocrystalline silicon carbide wafers. It is applied in the semiconductor industry for manufacturing high-power, high-frequency, and high-temperature electronic devices, such as power converters and RF components. The standard ensures wafer quality for use in advanced electronics, including electric vehicles, 5G communications, and industrial power systems.
Related Standards
GB/T 12964-2003
Monocrystalline silicon polished wafers
GB/T 16596-1996
Specification for establishing a wafer coordinatesystem
GB/T 16595-1996
Specification for a universal wafer grid
GB/T 12965-2005
Monocrystalline silicon as cut slices and lapped slices
GB/T 20230-2006
Indium phosphide single crystal
GB/T 20229-2006
Gallium phosphide single crystal
GB/T 20228-2006
Gallium arsenide single crystal
GB/T 11071-2006
Zone-refined germanium ingot
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.