GB/T 29508-2013
Active300mm monocrystalline silicon as cut slices and grinded slices
300mm 硅单晶切割片和磨削片
Application Summary AI generated
This standard specifies the technical requirements, test methods, inspection rules, and marking, packaging, transportation, and storage conditions for 300mm diameter monocrystalline silicon as-cut and grinded slices. It is applied in the semiconductor industry for the production of silicon wafers used in integrated circuit manufacturing, specifically for wafers that have been sliced from ingots or surface-ground to prepare them for subsequent polishing and device fabrication. The standard ensures dimensional consistency and quality control for these intermediate wafer forms in high-volume silicon processing.
Related Standards
GB/T 12964-2003
Monocrystalline silicon polished wafers
GB/T 16596-1996
Specification for establishing a wafer coordinatesystem
GB/T 16595-1996
Specification for a universal wafer grid
GB/T 12965-2005
Monocrystalline silicon as cut slices and lapped slices
GB/T 20230-2006
Indium phosphide single crystal
GB/T 20229-2006
Gallium phosphide single crystal
GB/T 20228-2006
Gallium arsenide single crystal
GB/T 11071-2006
Zone-refined germanium ingot
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.