GB/T 29506-2013
Active300mm polished monocrystalline silicon wafers
300mm 硅单晶抛光片
Application Summary AI generated
GB/T 29506-2013 specifies the technical requirements, test methods, inspection rules, and packaging for 300mm diameter polished monocrystalline silicon wafers used in semiconductor manufacturing. It is applied in the production of integrated circuits and microelectronic devices, ensuring wafer quality for processes like photolithography and doping. The standard is critical for quality control in silicon wafer fabrication facilities and for procurement specifications in the electronics industry.
Related Standards
GB/T 12964-2003
Monocrystalline silicon polished wafers
GB/T 16596-1996
Specification for establishing a wafer coordinatesystem
GB/T 16595-1996
Specification for a universal wafer grid
GB/T 12965-2005
Monocrystalline silicon as cut slices and lapped slices
GB/T 20230-2006
Indium phosphide single crystal
GB/T 20229-2006
Gallium phosphide single crystal
GB/T 20228-2006
Gallium arsenide single crystal
GB/T 11071-2006
Zone-refined germanium ingot
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.