GB/T 26069-2010
AbolishedSpecification for silicon annealed wafers
硅退火片规范
Application Summary AI generated
This standard specifies the technical requirements, test methods, inspection rules, and packaging for silicon annealed wafers used in semiconductor manufacturing. It is applied in the production and quality control of silicon wafers that have undergone thermal annealing to stabilize their electrical properties and reduce crystal defects. The standard ensures consistency and reliability for wafers intended for integrated circuit and discrete device fabrication.
Related Standards
GB/T 12964-2003
Monocrystalline silicon polished wafers
GB/T 16596-1996
Specification for establishing a wafer coordinatesystem
GB/T 16595-1996
Specification for a universal wafer grid
GB/T 12965-2005
Monocrystalline silicon as cut slices and lapped slices
GB/T 20230-2006
Indium phosphide single crystal
GB/T 20229-2006
Gallium phosphide single crystal
GB/T 20228-2006
Gallium arsenide single crystal
GB/T 11071-2006
Zone-refined germanium ingot
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.