GB/T 26067-2010

Active

Standard test method for dimensions of notches on silicon wafers

硅片切口尺寸测试方法

Standard Type

GBT

ICS

29.045

CCS

H80

Status

Active

Issue Date

2011-01-10

Implementation

2011-10-01

Centralized Committee

国家标准委

Issuing Authority

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

Application Summary AI generated

This standard specifies the test method for measuring the dimensions of notches on silicon wafers, including notch width, depth, and angle. It is applied in the semiconductor industry for quality control during wafer manufacturing and incoming inspection, ensuring that notches meet design specifications for proper alignment in photolithography and automated handling equipment.

Related Standards

GB/T 12964-2003 Monocrystalline silicon polished wafers GB/T 16596-1996 Specification for establishing a wafer coordinatesystem GB/T 16595-1996 Specification for a universal wafer grid GB/T 12965-2005 Monocrystalline silicon as cut slices and lapped slices GB/T 20230-2006 Indium phosphide single crystal GB/T 20229-2006 Gallium phosphide single crystal GB/T 20228-2006 Gallium arsenide single crystal GB/T 11071-2006 Zone-refined germanium ingot

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.