GB/T 16596-2019
ActiveSpecification for establishing a wafer coordinate system
确定晶片坐标系规范
Application Summary AI generated
This standard specifies the method for establishing a coordinate system on semiconductor wafers, defining the origin, axes, and orientation for precise location referencing. It is applied in the semiconductor manufacturing industry for wafer mapping, defect inspection, and lithography alignment to ensure consistent positional accuracy across processing and testing equipment.
Related Standards
GB/T 12964-2003
Monocrystalline silicon polished wafers
GB/T 16596-1996
Specification for establishing a wafer coordinatesystem
GB/T 16595-1996
Specification for a universal wafer grid
GB/T 12965-2005
Monocrystalline silicon as cut slices and lapped slices
GB/T 20230-2006
Indium phosphide single crystal
GB/T 20229-2006
Gallium phosphide single crystal
GB/T 20228-2006
Gallium arsenide single crystal
GB/T 11071-2006
Zone-refined germanium ingot
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.