GB/T 12965-2018

Active

Monocrystalline silicon as cut wafers and lapped wafers

硅单晶切割片和研磨片

Standard Type

GBT

ICS

29.045

CCS

H82

Status

Active

Issue Date

2018-09-17

Implementation

2019-06-01

Centralized Committee

国家标准委

Issuing Authority

国家市场监督管理总局、中国国家标准化管理委员会

Application Summary AI generated

This standard specifies the technical requirements, test methods, and inspection rules for monocrystalline silicon as-cut wafers and lapped wafers. It is applied in the semiconductor industry for the manufacturing and quality control of silicon wafers used in integrated circuits and discrete devices. The standard ensures dimensional accuracy, surface quality, and electrical properties during wafer production and incoming inspection.

Related Standards

GB/T 12964-2003 Monocrystalline silicon polished wafers GB/T 16596-1996 Specification for establishing a wafer coordinatesystem GB/T 16595-1996 Specification for a universal wafer grid GB/T 12965-2005 Monocrystalline silicon as cut slices and lapped slices GB/T 20230-2006 Indium phosphide single crystal GB/T 20229-2006 Gallium phosphide single crystal GB/T 20228-2006 Gallium arsenide single crystal GB/T 11071-2006 Zone-refined germanium ingot

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.