GB/T 9491-2021
ActiveFlux for tin soldering
锡焊用助焊剂
Application Summary AI generated
GB/T 9491-2021 specifies the classification, technical requirements, test methods, and inspection rules for fluxes used in tin soldering of electronic assemblies. It is applied in the electronics manufacturing industry to ensure the quality and reliability of soldering processes for printed circuit boards and electronic components. The standard is used by manufacturers and quality control labs to evaluate flux properties like activity, corrosiveness, and insulation resistance.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.