GB/T 4588.12-2000
ActiveSpecification for mass laminationpanels (semi-manufactured multilayer printed boards)
预制内层层压板规范(半制成多层印制板)
Application Summary AI generated
This standard specifies the requirements, test methods, and quality assurance for mass lamination panels used as semi-manufactured multilayer printed boards. It is applied in the electronics industry for the production of high-density interconnect boards, particularly during the lamination stage before final drilling and circuit patterning. The standard ensures consistency and reliability in the pre-fabricated inner layer stacks used by PCB manufacturers.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
GB/T 16317-1996
Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.