GB/T 1360-1998
ActiveGrid systems for printed circuits
印制电路网格体系
Application Summary AI generated
This standard specifies the grid system for printed circuits, defining the basic grid spacing and coordinate system used for designing and manufacturing printed circuit boards (PCBs). It is applied in the electronics industry to ensure compatibility and interchangeability between PCB layouts, component placement, and automated assembly equipment. The standard is particularly relevant for engineers and procurement professionals involved in PCB design, production, and quality control.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
GB/T 16317-1996
Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.