GB/T 18334-2001
AbolishedSpecification for flexible multilayer printed boards with through conections
有贯穿连接的挠性多层印制板规范
Application Summary AI generated
This standard specifies the requirements, test methods, and quality assurance procedures for flexible multilayer printed boards that utilize through connections (plated through-holes). It is applied in the electronics industry for the design, manufacturing, and inspection of flexible circuits used in compact, dynamic, or space-constrained applications such as mobile devices, medical equipment, and aerospace electronics. The standard ensures reliability and performance under mechanical flexing and thermal stress conditions.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
GB/T 16317-1996
Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.