GB/T 4677-2002
ActiveTest methods of printed boards
印制板测试方法
Application Summary AI generated
GB/T 4677-2002 specifies standardized test methods for evaluating the physical, electrical, and mechanical properties of printed circuit boards (PCBs). It is applied in the electronics manufacturing industry for quality control, reliability testing, and performance verification of PCBs used in consumer electronics, telecommunications, and industrial equipment. The standard ensures consistency in testing procedures such as solderability, insulation resistance, and dimensional measurements across production and laboratory environments.
Related Standards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
GB/T 16317-1996
Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.