GB/T 18335-2001
ActiveSpecification for flex-rigid multilayer printed boards with through connections
有贯穿连接的刚挠多层印制板规范
Application Summary AI generated
This standard specifies the requirements, quality assurance, and testing methods for flex-rigid multilayer printed boards that incorporate through connections. It is applied in the electronics industry for the design, manufacturing, and inspection of boards used in compact, high-reliability electronic devices such as mobile phones, aerospace equipment, and medical instruments, where both flexibility and rigidity are needed in a single circuit board.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
GB/T 16317-1996
Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.