GB/T 4725-1992
AbolishedEpoxide woven glass fabric copper-clad laminated sheets for printed circuits
印制电路用覆铜箔环氧玻璃布层压板
Application Summary AI generated
This standard specifies the requirements for epoxide woven glass fabric copper-clad laminated sheets used as base materials in the production of printed circuit boards (PCBs). It is applied in the electronics industry for manufacturing rigid PCBs, particularly in applications requiring good electrical insulation, mechanical strength, and thermal resistance, such as consumer electronics, telecommunications equipment, and industrial control systems. The standard defines performance criteria, dimensions, and testing methods to ensure consistent quality for PCB fabrication and assembly processes.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.