GB/T 4724-2017
ActiveComposite base copper clad laminated sheets for printed circuits
印制电路用覆铜箔复合基层压板
Application Summary AI generated
This standard specifies requirements for composite base copper clad laminates used in the manufacture of printed circuit boards (PCBs). It is applied in the electronics industry for producing rigid PCBs where mechanical strength and electrical insulation are needed, particularly in consumer electronics and telecommunications equipment. The standard ensures consistent material properties for etching, drilling, and soldering processes during PCB fabrication.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.