GB/T 4722-2017
ActiveTest methods for rigid copper clad laminates for printed circuits board
印制电路用刚性覆铜箔层压板试验方法
Application Summary AI generated
This standard specifies the test methods for evaluating the mechanical, electrical, thermal, and chemical properties of rigid copper clad laminates used in printed circuit boards (PCBs). It is applied in the electronics manufacturing industry for quality control, material acceptance, and performance verification of base materials used in consumer electronics, telecommunications, and industrial control equipment. The standard ensures consistency and reliability in PCB fabrication by providing standardized procedures for testing thickness, peel strength, insulation resistance, and solder resistance.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.