GB/T 46821-2025
ActiveTest methods for device embedded substrate
嵌入式基板测试方法
Application Summary AI generated
This standard specifies the test methods for evaluating the performance and reliability of device-embedded substrates, which are printed circuit boards with integrated passive or active components. It is applied in the electronics manufacturing industry, particularly for quality assurance and design validation of high-density interconnect substrates used in smartphones, automotive electronics, and IoT devices. The standard covers electrical, thermal, and mechanical tests to ensure the embedded devices function correctly under operational and environmental stress conditions.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.