GB/T 46696-2025
UpcomingSpecification for permanent solder mask
永久性阻焊材料规范
Application Summary AI generated
This standard specifies the performance requirements, test methods, and quality acceptance criteria for permanent solder mask materials used in printed circuit board (PCB) manufacturing. It applies to the electronics industry, particularly in the production of consumer electronics, communication equipment, and automotive electronics, ensuring solder masks provide reliable insulation, protection against environmental factors, and compatibility with soldering processes. The standard is used by PCB fabricators, material suppliers, and quality assurance teams to validate solder mask durability and adhesion under thermal, chemical, and mechanical stress.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.