GB/T 4588.4-2017
ActiveSectional specification for rigid multilayer printed boards
刚性多层印制板分规范
Application Summary AI generated
This standard specifies the requirements, quality assessment procedures, and test methods for rigid multilayer printed boards. It is applied in the electronics industry for the design, production, and procurement of multilayer circuit boards used in complex electronic devices such as computers, telecommunications equipment, and automotive electronics. The standard ensures reliability and performance consistency in high-density interconnection applications.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.