GB/T 45723-2025
ActiveTest method for printed board—Monitoring of single plated-through hole(PTH) resistance change during temperature cycling
印制电路板测试方法 温度循环状态下镀覆孔单孔电阻的变化
Application Summary AI generated
This standard specifies a test method for monitoring the resistance change of a single plated-through hole (PTH) in a printed circuit board (PCB) during temperature cycling. It is applied in the electronics industry to evaluate the reliability and structural integrity of PTHs under thermal stress, particularly for PCBs used in automotive, aerospace, and telecommunications equipment. The method helps detect potential failures like barrel cracking or interface separation by measuring resistance shifts across repeated temperature cycles.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.