GB/T 45714.54-2025
ActivePrinted circuit board materials—Part 5-4:Sectional specification set for conductive foils and films with or without coatings—Conductive pastes
印制电路板材料 第5-4部分： 涂覆或非涂覆的导电箔和膜分规范 导电浆料
Application Summary AI generated
This standard specifies the requirements, test methods, and quality assessment procedures for conductive pastes used in printed circuit board (PCB) manufacturing. It applies to the production and procurement of conductive pastes for forming conductive patterns, interconnections, or coatings on PCB substrates in the electronics industry. The standard ensures consistency and reliability in materials for applications such as membrane switches, flexible circuits, and surface mount technology.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.