GB/T 45660-2025
ActiveElectronics assembly technology—Electronic modules
电子装联技术 电子模块
Application Summary AI generated
GB/T 45660-2025 specifies technical requirements, inspection methods, and quality acceptance criteria for the assembly of electronic modules, including soldering, mounting, and interconnection processes. It is applied in the manufacturing and quality control of electronic modules used in consumer electronics, industrial control systems, and communication equipment. The standard ensures reliability and consistency in production environments where precise electronic assembly is critical.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.