GB/T 44295-2024
ActiveEpoxide woven E-glass prepreg for multilayer printed boards
多层印制板用环氧E玻纤布粘结片
Application Summary AI generated
This standard specifies the requirements, test methods, inspection rules, and packaging for epoxide woven E-glass prepreg used in the production of multilayer printed circuit boards (PCBs). It is applied in the electronics manufacturing industry, specifically for laminating and bonding inner-layer circuits during the fabrication of high-reliability multilayer boards. The standard ensures consistent material performance for dielectric insulation and adhesion in applications such as telecommunications, computing, and automotive electronics.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.