GB/T 43863-2024
ActiveFormat for LSI—Package—Board interoperable design
大规模集成电路（LSI） 封装 印制电路板共通设计结构
Application Summary AI generated
This standard specifies a unified data format for the interoperable design of large-scale integrated circuits (LSI), their packages, and printed circuit boards (PCBs). It is applied in the electronics industry to facilitate seamless data exchange and collaboration among chip designers, packaging engineers, and PCB layout teams during the development of complex electronic systems. The standard ensures design consistency and reduces errors in high-density interconnect applications, such as advanced computing and telecommunications hardware.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.