GB/T 43799-2024
ActiveSectional specification for high density interconnect printed boards
高密度互连印制板分规范
Application Summary AI generated
This standard specifies the performance, testing, and quality assessment requirements for high density interconnect (HDI) printed boards, including microvia structures, layer stack-ups, and reliability criteria. It is applied in the design, manufacturing, and procurement of HDI boards used in compact electronic products such as smartphones, tablets, and advanced computing modules. The standard ensures consistent quality and interoperability for HDI boards in industrial production and supply chain verification.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.