GB/T 43059-2023
ActiveRequirements of flatness control for printed boards and printed board assemblies
印制板及印制板组装件的平整度控制要求
Application Summary AI generated
This standard specifies the flatness control requirements for printed boards and printed board assemblies, including measurement methods and acceptance criteria. It is applied in the electronics manufacturing industry to ensure proper assembly, soldering, and reliability of components on boards used in consumer electronics, telecommunications, and industrial equipment. The standard is particularly relevant during production and quality inspection to prevent defects like solder joint stress or component misalignment caused by excessive board warpage.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.