GB/T 33772.2-2025
ActiveQuality assessment systems —Part 2: Selection and use of sampling plans for inspection of electronic components and packages
质量评定体系 第2部分：电子元器件及封装件检验用抽样方案的选择和使用
Application Summary AI generated
This standard provides guidelines for selecting and using sampling plans specifically for the quality inspection of electronic components and packages. It is applied in manufacturing and procurement contexts to determine statistically valid sample sizes and acceptance criteria, ensuring consistent product quality while balancing inspection costs. The standard is relevant for industries producing or testing semiconductors, integrated circuits, and other electronic parts.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.