GB/T 33772.1-2017
ActiveQuality assessment systems—Part 1: Registration and analysis of defects on printed board assemblies
质量评定体系 第1部分：印制板组件上缺陷的统计和分析
Application Summary AI generated
This standard specifies the methods for registering, classifying, and statistically analyzing defects found on printed board assemblies (PCBs with mounted components). It is applied in the electronics manufacturing industry for quality assessment, process control, and continuous improvement during the production and inspection of assembled circuit boards. The standard provides a systematic framework for defect data collection and analysis, enabling manufacturers to identify recurring issues and optimize assembly processes.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.