GB/T 33016-2016
ActiveTest methods for bongding sheet for multilayer printed boards
多层印制板用粘结片试验方法
Application Summary AI generated
This standard specifies the test methods for bonding sheets used in the production of multilayer printed circuit boards (PCBs). It is applied in the electronics manufacturing industry to evaluate properties such as resin flow, gel time, and volatile content, ensuring the bonding sheets meet quality requirements for reliable lamination in multilayer PCB fabrication.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.