GB/T 31988-2015
ActiveAluminium base copper clad laminate for printed circuits
印制电路用铝基覆铜箔层压板
Application Summary AI generated
GB/T 31988-2015 specifies the requirements, test methods, inspection rules, and marking for aluminium base copper clad laminates used in printed circuits. It is applied in the electronics industry for manufacturing high-power LED lighting, automotive electronics, and power supply modules where efficient heat dissipation is critical. The standard ensures consistent thermal conductivity, electrical insulation, and mechanical performance of the laminate for reliable circuit board production.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.