GB/T 31471-2015
ActiveGeneral specification for metal foil for printed circuits
印制电路用金属箔通用规范
Application Summary AI generated
This standard specifies the requirements, test methods, inspection rules, and packaging for metal foils (such as copper foil) used in the production of printed circuit boards (PCBs). It is applied in the electronics manufacturing industry to ensure the quality and consistency of metal foils used as conductive layers in rigid and flexible PCBs, particularly for consumer electronics, communication equipment, and automotive electronics. The standard is critical for procurement and quality control in PCB fabrication, defining parameters like thickness, adhesion, and surface roughness.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.