GB/T 19405.4-2025
UpcomingSurface mounting technology—Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
表面安装技术 第4部分：湿敏器件的处理、标记、包装和分类
Application Summary AI generated
This standard specifies the classification, packaging, labeling, and handling requirements for moisture-sensitive surface mount devices (SMDs) to prevent damage from moisture absorption during soldering. It is applied in the electronics manufacturing industry, particularly for printed circuit board (PCB) assembly processes involving reflow soldering. The standard ensures reliable production by defining moisture sensitivity levels (MSL) and storage conditions for components like ICs and LEDs.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.