GB/T 19405.3-2025
ActiveSurface mounting technology—Part 3:Standard method for the specification of components for through hole reflow（THR）soldering
表面安装技术 第3部分：通孔回流焊用元器件规范的标准方法
Application Summary AI generated
This standard specifies the requirements and test methods for electronic components designed for through-hole reflow (THR) soldering, ensuring compatibility with surface mount assembly processes. It is applied in the electronics manufacturing industry, particularly for components like connectors, switches, and sensors that must withstand reflow oven temperatures while maintaining reliable solder joints. The standard guides engineers and procurement professionals in specifying and verifying components for mixed-technology circuit boards where THR is used alongside surface mount devices.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.