GB/T 19247.6-2024
ActivePrinted board assemblies—Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
印制板组装 第6部分:球栅阵列（BGA）和盘栅阵列（LGA）焊点空洞的评估要求及测试方法
Application Summary AI generated
This standard specifies evaluation criteria and measurement methods for voids in soldered joints of Ball Grid Array (BGA) and Land Grid Array (LGA) components on printed board assemblies. It is applied in the electronics manufacturing industry for quality control and reliability testing of surface-mount solder connections, particularly in high-density packaging for consumer electronics, telecommunications, and automotive systems. The standard provides acceptance thresholds for void size and distribution to ensure joint integrity and prevent failures during thermal or mechanical stress.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.