GB/T 16315-2017
ActivePolymide woven glass fabric copper clad laminated sheets for printed circuits
印制电路用覆铜箔聚酰亚胺玻纤布层压板
Application Summary AI generated
GB/T 16315-2017 specifies the requirements for polyimide woven glass fabric copper-clad laminates used in the production of printed circuit boards (PCBs). It is applied in the electronics industry for manufacturing high-reliability PCBs that require excellent thermal stability, chemical resistance, and electrical insulation, particularly in aerospace, military, and high-temperature electronic applications. The standard defines material properties, dimensional tolerances, and testing methods to ensure consistent performance in demanding environments.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.