GB/T 14708-1993
AbolishedAdhesive coated polyester film for flexibleprinted circuits
挠性印制电路用涂胶聚酯薄膜
Application Summary AI generated
GB/T 14708-1993 specifies the requirements for adhesive-coated polyester film used as a base material in the production of flexible printed circuits. It is applied in the electronics industry for manufacturing flexible circuit boards, particularly in applications requiring thin, bendable substrates such as consumer electronics, automotive components, and medical devices. The standard defines material properties like adhesion strength, dimensional stability, and electrical insulation to ensure reliability during circuit fabrication and end-use.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.