GB/T 14515-1993
AbolishedSpecification for single and double sided flexible printed boards with through connections
有贯穿连接的单、双面挠性印制板技术条件
Application Summary AI generated
This standard specifies the technical requirements, test methods, and quality acceptance criteria for single and double-sided flexible printed circuit boards that utilize through-hole connections. It is applied in the manufacturing and quality control of flexible electronic circuits used in compact, movable, or space-constrained electronic devices such as mobile phones, cameras, and medical equipment. The standard ensures reliability in bending, soldering, and electrical performance during production and inspection.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.