GB/T 13557-2017
ActiveTest methods for copper-clad material for flexible printed circuits
印制电路用挠性覆铜箔材料试验方法
Application Summary AI generated
This standard specifies the test methods for evaluating the physical, electrical, and mechanical properties of copper-clad laminates used in flexible printed circuits. It is applied in the electronics industry for quality control and performance verification of flexible copper-clad materials during manufacturing and procurement. The standard ensures these materials meet reliability requirements for applications such as consumer electronics, automotive electronics, and medical devices.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.