GB/T 13555-2017
ActiveCopper-clad polyimide film laminates for flexible printed circuits
挠性印制电路用聚酰亚胺薄膜覆铜板
Application Summary AI generated
This standard specifies the requirements, test methods, and quality specifications for copper-clad polyimide film laminates used as the base material in flexible printed circuits. It is applied in the manufacturing of flexible electronic assemblies, such as those found in mobile devices, medical electronics, and automotive sensors, where thin, bendable circuit boards are needed. The standard ensures consistent electrical insulation, adhesion strength, and thermal stability for reliable performance in dynamic flexing and high-temperature environments.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.