GB/T 13555-1992
AbolishedFlexible copper-clad polyimide film for printed circuits
印制电路用挠性覆铜箔聚酰亚胺薄膜
Application Summary AI generated
This standard specifies the requirements, test methods, and quality specifications for flexible copper-clad polyimide film used in the manufacture of printed circuits. It is applied in the electronics industry for producing flexible circuit boards that require high thermal stability and mechanical flexibility, such as those used in mobile devices, aerospace electronics, and medical equipment. The standard ensures consistent material properties for reliable performance in dynamic bending and high-temperature environments.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.