GB/T 12630-1990
ActiveThin epoxide woven glass fabric copper-clad laminated sheet， general purpose grade， for use in the fabrication of multilayer printed boards
一般用途的薄覆铜箔环氧玻璃布层压板 (制造多层印制板用)
Application Summary AI generated
This standard specifies the requirements for thin epoxy glass fabric copper-clad laminates of general purpose grade, used as the base material for fabricating multilayer printed circuit boards (PCBs). It is applied in the electronics industry to ensure consistent thickness, electrical insulation, and copper adhesion for reliable interlayer connections in multilayer boards. The standard is particularly relevant for manufacturers and quality control in PCB production, where these laminates serve as core or prepreg layers.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.