GB/T 12629-1990
AbolishedThin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
限定燃烧性的薄覆铜箔环氧玻璃布层压板 (制造多层印制板用)
Application Summary AI generated
This standard specifies the requirements for thin, flame-retardant epoxy glass fabric copper-clad laminates used as core or prepreg material in the production of multilayer printed circuit boards (PCBs). It is applied in the electronics industry to ensure consistent dielectric properties, copper adhesion, and controlled flammability for reliable layer-to-layer bonding in high-density interconnect boards. The standard is primarily referenced during material qualification and incoming inspection by PCB manufacturers and electronics assembly facilities.
Related Standards
GB/T 4677-2002
Test methods of printed boards
GB/T 4588.3-2002
Design and use of printed boards
GB/T 18335-2001
Specification for flex-rigid multilayer printed boards with through connections
GB/T 18334-2001
Specification for flexible multilayer printed boards with through conections
GB/T 4588.12-2000
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
GB/T 1360-1998
Grid systems for printed circuits
GB/T 4588.4-1996
Sectional specification--Multilayer printed boards
GB/T 16315-1996
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.